Next-Gen Packaging: European Chips Act and Advances in Microelectronics & Photonics

Business Finland together with Business Tampere and IMAPS Nordic are organizing Next-Gen Packaging: European Chips Act and Advances in Microelectronics & Photonics event in Tampere, Finland. 

In the fields of microelectronics and photonics, packaging plays an increasingly critical role. Packaging in microelectronics and photonics is not anymore merely about enclosing or protecting the device but is a complex, technology-driven component critical to device performance, reliability, and integration. The role of packaging in microelectronics and photonics within the current geopolitical landscape is becoming increasingly significant, given the complex interplay of technology advancements, supply chain challenges, and national security considerations.

In summary, packaging is increasingly being recognized as a crucial element in the value chain of manufacturing. Keynote address is delivered by ASE Group, a leading innovator in heterogeneous integration, followed by updates and discussions on topical matters.

Agenda

14:00 Welcome and opening words

• Business Finland, Business Tampere & IMAPS Nordic

14:10 Keynote: Advanced packaging and system integration

• Martin Jaiser, Technical Project Management and Business Development, ASE

15:00 Growth from semiconductors

• Tomy Runne, Chair of Semiconductor Branch Group, Technology Industries of Finland

15:20 Developments from Finnish Semiconductor Industry

• Tomi Salo, Co-Creation Manager, Kvanttinova
• Juha Purmonen, Executive Director, Photonics Finland
• Mircea Guina, Professor, SiPFAB

15:50 Coffee break

16:20 Panel discussion: Future Visions and Opportunities of Packaging Industry

• Moderator: Tuomas Hollman, Director, Bosch Sensortec
  Panelists:
• Ville Hevonkorpi, Managing Director, Schott Primoceler
• Senni Laaksonen, Vice President, Research and Development, Murata
• Veijo Kontas, Head of SoC, Nokia Mobile Network
• Martin Jaiser, Technical Project Management and Business Development, ASE

17:00 NordPac exhibitors and sponsors brief introductions

18:00 Evening program

• Welcome words
• Networking
• Light dinner
• Meet NordPac 2024 Exhibitors and Sponsors

21:00 Event ends

The program is subject to change.

The event is part of IMAPS Nordic Annual Microelectronics Packaging Conference and Exhibition (NordPac) that is held in Tampere, Finland during 11-13 June 2024. Read more and register. Please note that registering to Next-Gen Packaging: European Chips Act and Advances in Microelectronics & Photonics event is free of charge, but it does not give access to full Conference and Exhibition but only to the event held in the afternoon of June 11th. See more for full Conference and Exhibition registration.